Optical Lithography

• UV Maskless lithography system Heidelberg µMLA (2019)
• Laser lithography system Microtech LW405D (2015 + Upgrade 2023)
• Mask Aligner Suss Microtec MJB4 (2007)
• Mask Aligner Karl Suss MJB3 (1988)
• Spin-coaters Suss Microtec LabSpin6 under laminar flow (x 2)

Electron Beam Lithography

• Ebeam lithography Raith E-Line (2008 + Upgrade 2023)
• Scanning Electron Microscope FEI XL30 SFEG (1998)
  + lithography system Raith Elphy

Thin Films Deposition

• Electron Beam Evaporator Plassys MEB 450 (1990) [Ti, Y, Cu, Pt, Pd, Al, Au, Ge]
• Electron Beam Evaporator MEB 550S Turbo (2007) [Al, Cr, GrAl, Pt, Nb, Ti, Al2O3, Au]
• Electron Beam Evaporator Plassys MEB 550S Cryo (2015) [Ti, Ge, Al2O3, Hf, Nb, Pd, Ag, Al]
• Sputtering DC Alcatel SCM400 (1987) [Al, Nb, Ti, Ta]
• Sputtering RF Plassys MP300 monocible pour isolants [SiO₂, SiN, Al₂O₃, NbTiN, TiN]
• UHV System Meca 2000, electron beam evaporator, multi-target sputtering RF, ion beam etch.

Wet Etching

• Chemical hoods with extraction (x 5)

Dry Etching

• Plasma Etcher RIE Plassys MG200 (1989)
  [SF6, CHF3, CF4, O2, Ar]
• Asher (downstream stripper) [O2, N2]
• Ion Beam coupled to a SIMS [Ar]

Characterization

• Profilometer Dektak XT (2020)
• AFM Asylum MRP-3D (2015)
• Thickness Measurement by Interferometer Filmetrics
• Prober Karl Suss
• Optical Microscopes with numerical acquisition (x 5)
• Numerical Microscope Keyence VHX-7000 (2024)

Others

• Diamond Blade Disco DAD 3350
• Micro-welder by ultrasound TpT (wegde bond)
• Micro-welder by ultrasound K&S (ball bond)
• Micro-welder by ultrasound K&S (wegde bond)
• Supercritical dryer Euris
• Scriber Karl Suss